Take a 3D Tour of the Integrated Packaging Solutions that Yaskawa is featuring at PACK EXPO 2014
Yaskawa is looking forward to Pack Expo next week to show the industry some exciting developments designed to simplify implementation and operation for picking, packing and palletizing automation projects.
We created a 3D tour of the packaging cells we will be featuring at this year's show. Take the tour to experience:
- An integrated primary and secondary packaging cell
- Compact, high-speed picking
- Palletizing and depalletizing using the latest in 3D vision and intelligent software
- Unified controls architecture
Take the 3D Tour (best viewed on a desktop computer with Google Chrome browser)
